MULTILAYER EPITAXIAL SILICON STRUCTURES WITH SUBMICRON LAYERS GROWN BY SUBLIMATION MOLECULAR BEAM EPITAXI

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Abstract

Multilayer silicon diode structures with basic submicron layers of n- and p-types of conductivity were grown by sublimation molecular beam epitaxy. The distribution profiles of the charge carrier concentrations (electrons and holes) were determined by the volt-farad characteristics method. The use of silicon sublimation sources cut from silicon ingots doped with phosphorus or boron makes it possible to achieve a uniform distribution of charge carrier concentrations over the thickness of the layers and an extremely sharp profile at their boundary with the Si substrate. Such structures can be successfully used for the manufacture of diodes.

About the authors

V. G. Shengurov

Lobachevsky State University

Email: shengurov@phys.unn.ru
Nizhny Novgorod, Russia

A. M. Titova

Lobachevsky State University

Email: asya_titova95@mail.ru
Nizhny Novgorod, Russia

N. A. Alyabina

Lobachevsky State University

Email: asya_titova95@mail.ru
Nizhny Novgorod, Russia

V. Yu. Chalkov

Lobachevsky State University

Email: asya_titova95@mail.ru
Nizhny Novgorod, Russia

S. A. Denisov

Lobachevsky State University

Email: asya_titova95@mail.ru
Nizhny Novgorod, Russia

A. V. Zdoroveyshchev

Lobachevsky State University

Author for correspondence.
Email: asya_titova95@mail.ru
Nizhny Novgorod, Russia

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